Bergquist Hi-Flow 225UT導熱絕緣相變化材料

材料生產商：美國貝格斯（BERGQUIST）公司研發產品

Hi-Flow 225UT可供規格：

厚度： 0.077mm  0.127mm

片材： 279.4 mm*304.8 mm

卷材：  279.4mm*76.2 m

相變化溫度：55℃

導熱系數：0.7W/m-K

表面粘性：雙面自帶黏性

顏色：黑色

Hi-Flow 225UT應用材料特性：

壓敏相變化導熱界面材料，具有天然粘性的55℃相變化復合物，高可視度的保護膜拉片

Hi-Flow 225UT材料說明：

Hi-Flow 225UT是一款設計應用于高性能處理器的發熱元器件和散熱器之間導熱的壓敏界面材料，它是一種具有天然粘性的55℃相變化復合物，該材料背面有PET離型膜，正面附有高可視度的保護膜拉片。一旦達到55℃的相變化溫度，Hi-Flow 225UT立刻潤濕導熱界面，流動的特性帶來最低的熱陰，裝配時需要一定的壓力讓材料流動，流動時涂層不會滴漏。

Hi-Flow 225UT典型應用：

彈片/扣具安裝

獨立的功率半導體和模塊

Hi-Flow 225UT技術優勢分析：

可按客戶尺寸模切，僅限于正方形和長方形.提供經過模切的卷材制品，啤半穿、除廢料，附有拉片（不能有孔）

Hi-Flow? 225UT is designed as a pressure sensitive thermal interface material for use between a high performance processor and a heat sink. Hi-Flow? 225UT is a thermally conductive 55°C phase change composite with inherent tack. The material is supplied on a polyester carrier liner and is available with high-visibility protective tabs. Above its phase change temperature,

Hi-Flow? 225UT wets-out the thermal interface surfaces and flows to produce the lowest thermal impedance. The material requires pressure of the assembly to cause flow. Hi-Flow? 225UT coatings will resist dripping.

Application Methods

 1. Hand-apply Hi-Flow? 225UT to a room- temperature heat sink. The Hi-Flow? 225UT pad exhibits inherent tack and can be hand-applied similar to an adhesive pad. The tab liner can remain on the heat sink and pad throughout shipping and handling until is it is ready for final assembly.